Lenovo Fan Cooling 1U SR630 SR655 SR635 1U FAN MOD 4F17A12358

Product Identification

• Part Number: 4F17A12358

• Manufacturer: Lenovo

• Product Name: ThinkSystem 1U Fan Module

• Category: Server Cooling / Fan Option Kit

• Form Factor: 1U server fan module

Product Description

The Lenovo 4F17A12358 is a hot-swap system cooling fan module designed for Lenovo ThinkSystem 1U rack servers. It provides forced-air cooling for CPU, memory, and internal components, ensuring thermal stability in high-density enterprise environments.

This module is used in servers such as:

• ThinkSystem SR630

• ThinkSystem SR635

• ThinkSystem SR655

It is part of Lenovo’s modular cooling architecture, allowing redundant, field-replaceable airflow management in mission-critical systems.

Key Specifications

General

• Product Type: Cooling fan module

• Server Form Factor: 1U rackmount

• Application: Enterprise server thermal management

• Hot-Swap: Yes (field replaceable, no shutdown required — typical for ThinkSystem fans)

Mechanical

• Module Type: Plug-in fan cartridge

• Mounting: Internal chassis slot (fan bay)

• Cooling Method: High-speed axial fan(s) in modular housing

• Airflow Direction: Front-to-back (standard data center airflow)

Electrical (Typical for Lenovo 1U fan modules)

(Exact values not always published for FRU parts; based on platform characteristics)

• Voltage: 12V DC (server rail standard)

• Control: PWM-controlled variable speed

• Connector: Board-mounted blind-mate interface

Performance Characteristics

• Cooling Role:

  • CPU thermal dissipation

  • DIMM / memory cooling

  • PCIe and storage airflow

• Redundancy Support: Yes (N+1 fan redundancy depending on configuration)

• Speed Control: System-managed via Lenovo XClarity / firmware

Compatibility

• Primary Systems:

  • Lenovo ThinkSystem SR635 (7Y99 platform)

• Also used across similar 1U platforms:

  • SR630 / SR655 (shared thermal design family)

Functional Characteristics

Thermal Management Role

• Maintains safe operating temperatures for:

  • CPUs (high TDP Xeon / EPYC)

  • Memory modules

  • Storage controllers

• Enables high-density compute workloads without thermal throttling

System Integration

• Fully integrated with:

  • Lenovo XClarity Controller (XCC)

  • BIOS thermal profiles

• Supports:

  • Dynamic fan curves

  • Failure detection & alerting

  • Automatic speed ramp under load

Serviceability

• Hot-pluggable design minimizes downtime

• Designed for tool-less replacement

• Identified as FRU (Field Replaceable Unit)

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Design Notes (Typical Lenovo 1U Fan Architecture)

• High-RPM dual-rotor or single-rotor axial fan design

• Optimized for:

  • Static pressure (important for dense server chassis)

  • Directed airflow channels

• Works with air shrouds to guide airflow over CPUs and DIMMs

Operational Context

• Used in data center / enterprise IT environments

• Critical for:

  • Virtualization clusters

  • Storage servers

  • High-performance compute nodes

Failure or removal typically results in:

• Immediate fan redundancy alert

• Possible thermal throttling or shutdown if insufficient cooling

Positioning Insight

This part is not just a “fan”—it’s a system-level thermal component tied into:

• Firmware control loops

• Redundancy schemes

• Data center airflow standards

From a sourcing standpoint (relevant to your work), it falls under:

• Server FRU / spare parts

• High replacement frequency due to wear (moving component)

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